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Switching power supply failure analysis method

source:Industry News Popular:adapter release time:2022-01-21 09:54:34 Article author:sznbone

  Single power supply

  In the failure analysis of the switching power supply process, the X-ray inspection used is a multi-purpose method. It can be used as a purely non-destructive method to determine the internal state of components, as well as a diagnostic means to determine the degree of internal damage and performance degradation or to aid in anatomy, depicting the relative closeness of each component to other components and the outer cover, by performing twice Observation with a difference of 90° can obtain basic information about the internal geometry of the component. When the component is opened for visual inspection, abnormal conditions can be found.

  As a means of analysis, X-ray radiographic inspection allows direct inspection of the solder joints of printed circuit board components for cracks, separation, and various manufacturing abnormalities. The important use of X-rays is to perform non-destructive inspection of invisible parts, such as switching power supply PCB solder joints, PCB vias, PCB traces and internal structure of components. X-ray radiographic inspection can be disassembled


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